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november 2011 doc id 15354 rev 4 1/12 12 2N3700HR hi-rel 80 v - 1 a npn bipolar transistor features hi-rel npn bipolar transistor linear gain characteristics escc qualified european preferred part list - eppl 100 krad low dose rate radiation level: lot specific total dose contact marketing for specified level description the 2N3700HR is a silicon planar epitaxial npn transistor in to-18 and lcc-3 packages. it is specifically designed for aerospace hi-rel applications and escc qualified according to the 5201-004 specification. in case of conflict between this datasheet and escc detailed specification, the latter prevails. figure 1. internal schematic diagram bv ceo 80 v i c (max) 1 a h fe at 10 v - 150 ma > 100 operating temperature range -65c to +200c to-18 lcc-3 3 1 2 lcc-3ub 3 1 2 4 3 1 2 table 1. device summary order codes escc part num. qual. level rad level packages lead finish mass (g) eppl 2n37000ub1 - eng. model lcc-3ub gold 0.06 - 2n37000ubsw 5201/004/07 escc flight 100 krad lcc-3ub solder dip 0.06 y 2n37000ub06 5201/004/06 escc flight lcc-3ub gold 0.06 - 2n37000ub07 5201/004/07 escc flight lcc-3ub solder dip 0.06 - soc37000 - eng. model lcc-3 gold 0.06 - soc3700sw 5201/004/05 escc flight 100 krad lcc-3 solder dip 0.06 y soc3700hrb 5201/004/04 or 05 es cc flight lcc-3 gold/solder dip (1) 0.06 y 2n3700t1 - eng. model to-18 gold 0.40 - 2N3700HR 5201/004/01 or 02 escc flight to-18 gold/solder dip (1) 0.40 - 1. depending escc part number mentioned on the purchase order www.st.com
electrical ratings 2N3700HR 2/12 doc id 15354 rev 4 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit v cbo collector-base voltage (i e = 0) 140 v v ceo collector-emitter voltage (i b = 0) 80 v v ebo emitter-base voltage (i c = 0) 7 v i c collector current 1 a p tot total dissipation at t amb 25 c for 2N3700HR for soc3700hrb for soc3700hrb (1) total dissipation at t c 25 c for 2N3700HR 1. when mounted on a 15 x 15 x 0.6 mm ceramic substrate. 0.5 0.5 0.76 1.8 w w w w t stg storage temperature -65 to 200 c t j max. operating junction temperature 200 c table 3. thermal data for through-hole package symbol parameter to-18 unit r thjc r thja thermal resistance junction-case __ max thermal resistance junction-ambient __ max 97 350 c/w c/w table 4. thermal data for smd package symbol parameter soc unit r thja r thja thermal resistance junction-ambient max thermal resistance junction-ambient (1) max 1. when mounted on a 15 x 15 x 0.6 mm ceramic substrate. 350 230 c/w c/w
2N3700HR electrical characteristics doc id 15354 rev 4 3/12 2 electrical characteristics t case = 25 c unless otherwise specified. table 5. electrical characteristics symbol parameter test conditions min. typ. max. unit i cbo collector cut-off current (i e = 0) v cb = 90 v v cb = 90 v t amb = 110 c v cb = 90 v t amb = 150 c 10 100 10 na na a i ebo emitter cut-off current (i c = 0) v eb = 5 v 10 na v (br)cbo collector-base breakdown voltage (i e = 0) i c = 100 a 140 v v (br)ceo (1) 1. pulsed duration = 300 s, duty cycle 2 % collector-emitter breakdown voltage (i b = 0) i c = 30 ma 80 v v (br)ebo emitter-base breakdown voltage (i c = 0) i e = 100 a 7 v v ce(sat) (1) collector-emitter saturation voltage i c = 150 ma i b = 15 ma i c = 500 ma i b = 50 ma 0.2 0.5 v v v be(sat) (1) base-emitter saturation voltage i c = 150 ma i b = 15 ma i c = 150 ma i b = 15 ma t amb = 110 c 0.75 0.65 0.87 0.77 1 0.9 v v h fe (1) dc current gain i c = 10 ma v ce = 10 v i c = 150 ma v ce = 10 v i c = 500 ma v ce = 10 v i c = 150 ma v ce = 10 v t amb = - 55 c 90 100 50 40 300 h fe small signal current gain v ce = 10 v i c = 50 ma f = 20 mhz 5 c cbo output capacitance (i e = 0) v cb = 10 v f = 1 mhz 12 pf c ibo input capacitance (i c = 0) v eb = 0.5 v f = 1 mhz 60 pf
electrical characteristics 2N3700HR 4/12 doc id 15354 rev 4 2.1 electrical characteristics (curves) figure 2. dc current gain (v ce =1 v) figure 3. dc current gain (v ce =10 v) figure 4. collector emitter saturation voltage figure 5. base emitter saturation voltage !-v ,f$ ( ?# ?# ?# 6 #% 6 !-v ,f$ ( ?# ?# ?# 6 #% 6 !-v ,f$ ?# ?# ?# h &% 6 !-v ,f$ ?# ?# ?# h &% 6
2N3700HR electrical characteristics doc id 15354 rev 4 5/12 2.2 test circuit figure 6. resistive load switching test circuit 1. fast electronic switch 2. non-inductive resistor
package mechanical data 2N3700HR 6/12 doc id 15354 rev 4 3 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark.
2N3700HR package mechanical data doc id 15354 rev 4 7/12 figure 7. lcc-3ub drawings table 6. lcc-3ub mechanical data dim. mm. min. typ. max. a 1.16 1.42 c 0.46 0.51 0.56 d 0.56 0.76 0.96 e 0.92 1.02 1.12 f 1.95 2.03 2.11 g 2.92 3.05 3.18 i 2.41 2.54 2.67 j 0.42 0.57 0.72 k 1.37 1.52 1.67 l 0.41 0.51 0.61 m 2.46 2.54 2.62 n 1.81 1.91 2.01 r 0.20 r1 0.30 r2 0.56
package mechanical data 2N3700HR 8/12 doc id 15354 rev 4 figure 8. lcc-3 drawings table 7. lcc-3 mechanical data dim. mm. min. typ. max. a 1.16 1.42 c 0.45 0.50 0.56 d 0.60 0.76 0.91 e 0.91 1.01 1.12 f 1.95 2.03 2.11 g 2.92 3.05 3.17 i 2.41 2.54 2.66 j 0.42 0.57 0.72 k 1.37 1.52 1.67 l 0.40 0.50 0.60 m 2.46 2.54 2.62 n 1.80 1.90 2.00 r 0.30
2N3700HR package mechanical data doc id 15354 rev 4 9/12 figure 9. to-18 drawings table 8. to-18 mechanical data dim. mm. min. typ. max. a 12.7 b 0.49 d 5.3 e 4.9 f 5.8 g 2.54 h 1.2 i 1.16 l 45
order codes 2N3700HR 10/12 doc id 15354 rev 4 4 order codes contact st sales office for informati on about the specific conditions for: ? products in die form ? tape and reel packing table 9. order codes order codes escc part number rad level packages lead finish marking eppl packing 2n37000ub1 - lcc-3ub gold 2n37000ub1 - waffle pack 2n37000ubsw 5201/004/07 100 krad lcc-3ub solder dip 520100407 y waffle pack 2n37000ub06 5201/004/06 lcc-3ub gold 520100406 - waffle pack 2n37000ub07 5201/004/07 lcc-3ub solder dip 520100407 - waffle pack soc37000 - lcc-3 gold soc3700 - waffle pack soc3700sw 5201/004/05 100 krad lcc-3 solder dip 520100405 y waffle pack soc3700hrb 5201/004/04 or 05 lcc-3 gold or solder dip (1) 1. depending escc part number mentioned on the purchase order 520100404 or 05 y waffle pack 2n3700t1 - to-18 gold 2n3700t1 - strip pack 2N3700HR 5201/004/01 or 02 to-18 gold or solder dip (1) 520100401 or 02 - strip pack
2N3700HR revision history doc id 15354 rev 4 11/12 5 revision history table 10. document revision history date revision changes 10-jan-2008 1 initial release 07-jan-2010 2 modified table 1 on page 1 26-jul-2010 3 modified table 1 on page 1 , added table 9 on page 10 30-nov-2011 4 ? modified: table 5 on page 3 ? added: section 2.1: electrical characteristics (curves) ? minor text change in the document title on the coverpage
2N3700HR 12/12 doc id 15354 rev 4 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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